SCES531M December   2003  – October 2024 SN74AVC2T45

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics: VCCA = 1.2 V
    7. 5.7  Switching Characteristics: VCCA = 1.5 V ±0.1 V
    8. 5.8  Switching Characteristics: VCCA = 1.8 V ±0.15 V
    9. 5.9  Switching Characteristics: VCCA = 2.5 V ±0.2 V
    10. 5.10 Switching Characteristics: VCCA = 3.3 V ±0.3 V
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Characteristics
      1. 5.12.1 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 1.2 V
      2. 5.12.2 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 1.5 V
      3. 5.12.3 Typical Propagation Delay (A-to-B) vs Load Capacitance, TA = 25°C, VCCA = 1.8 V
      4. 5.12.4 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 2.5 V
      5. 5.12.5 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 3.3 V
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VCC Isolation
      2. 7.3.2 2-Rail Design
      3. 7.3.3 IO Ports are 4.6-V Tolerant
      4. 7.3.4 Partial-Power-Down Mode
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Unidirectional Logic Level-Shifting Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Bidirectional Logic Level-Shifting Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Enable Times
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCU|8
  • DDF|8
  • YZP|8
  • DCT|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)SN74AVC2T45UNIT
DCT (SM8)DCU (VSSOP)

DDF (SOT-23)

YZP (DSBGA)
8 PINS8 PINS

8 PINS

8 PINS
RθJAJunction-to-ambient thermal resistance

194.4

199.3

203.2

105.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance

124.7

76.2

121.5

1.6°C/W
RθJBJunction-to-board thermal resistance106.8

80.6

99.8

10.8°C/W
ψJTJunction-to-top characterization parameter

49.8

7.1

21.4

3.1°C/W
ψJBJunction-to-board characterization parameter105.8

80.1

99.5

10.8°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.