SCES588C August   2004  – August 2020 SN74AVCH24T245

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics
    7. 6.7  Switching Characteristics
    8. 6.8  Switching Characteristics
    9. 6.9  Switching Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.2-V to 3.6-V Power-Supply Range
      2. 8.3.2 Partial-Power-Down Mode Operation
      3. 8.3.3 VCC Isolation
      4. 8.3.4 Bus-Hold Circuitry
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 EnableTimes
    3. 9.3 Typical Application
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Input Voltage Ranges
        2. 9.3.2.2 Output Voltage Range
      3. 9.3.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Related Documentation
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)SN74AVCH24T245UNIT
GRGZRGNMU
838383
R θJAJunction-to-ambient thermal resistance 38.138.144.3°C/W
R θJC(top)Junction-to-case (top) thermal resistance 22.822.824.5°C/W
R θJBJunction-to-board thermal resistance 17.017.029.1°C/W
ψ JTJunction-to-top characterization parameter 0.440.440.5°C/W
ψ JBJunction-to-board characterization parameter 16.916.929.2°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.