SCES967 February   2024 SN74AVCH4T245-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 1.2V ± 0.12V
    7. 5.7  Switching Characteristics, VCCA = 1.5V ± 0.1V
    8. 5.8  Switching Characteristics, VCCA = 1.8V ± 0.15V
    9. 5.9  Switching Characteristics, VCCA = 2.5V ± 0.2V
    10. 5.10 Switching Characteristics, VCCA = 3.3V ± 0.3V
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully Configurable Dual-Rail Design
      2. 7.3.2 Supports High Speed Translation
      3. 7.3.3 Ioff Supports Partial-Power-Down Mode Operation
      4. 7.3.4 Bus-Hold Circuitry
      5. 7.3.5 Vcc Isolation Feature
    4. 7.4 Device Functional Modes
  9.   Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Tape and Reel Information
    2. 10.2 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Recommended Operating Conditions

see (1)(2)(3)(4)(5)
VCCIVCCOMINMAXUNIT
VCCASupply voltage1.083.6V
VCCBSupply voltage1.083.6V

1.08V

VCCI  × 0.7
VIHHigh-level
input voltage		Data inputs(4)1.1V to 1.95VVCCI  × 0.65V
2V to 2.7V1
2.8V to 3.6V

1.4

VILLow-level
input voltage		Data inputs(4)1.08VVCCI  × 0.3V
1.1V to 1.95VVCCI  × 0.35
2V to 2.7V1.5
2V to 3.6V

1.9

VIHHigh-level
input voltage		DIR
(referenced to VCCA)(5)		1.08V to 1.95VVCCA  × 0.65V
2V to 2.7V1
3V to 3.6V

1.3

VILLow-level
input voltage		DIR
(referenced to VCCA)(5)		1.08V to 1.95VVCCA  × 0.35V
2V to 2.7V

1.3

3V to 3.6V

1.7

VIInput voltage03.6V
VOOutput voltageActive state0VCCOV
3-state03.6
IOHHigh-level output current1.08V to 1.32V–3mA
1.4V to 1.6V–6
1.65V to 1.95V–8
2.3V to 2.7V–9
3V to 3.6V–12
IOLLow-level output current1.08V to 1.32V3mA
1.4V to 1.6V6
1.65V to 1.95V8
2.3V to 2.7V9
3V to 3.6V12
Δt/ΔvInput transition rise or fall rate5ns/V
TAOperating free-air temperature–40125°C
(1) VCCI is the VCC associated with the input port.
(2) VCCO is the VCC associated with the output port.
(3) All unused data inputs of the device must be held at VCCI or GND for proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
(4) For VCCI values not specified in the data sheet, VIH min = VCCI  × 0.7V, VIL max = VCCI  × 0.3V.
(5) For VCCA values not specified in the data sheet, VIH min = VCCA  × 0.7V, VIL max = VCCA  × 0.3V.