SCES565J April   2004  – April 2024 SN74AVCH8T245

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 1.2V
    7. 5.7  Switching Characteristics, VCCA= 1.5V ± 0.1V
    8. 5.8  Switching Characteristics, VCCA= 1.8V ± 0.15V
    9. 5.9  Switching Characteristics, VCCA= 2.5V ± 0.2V
    10. 5.10 Switching Characteristics, VCCA= 3.3V ± 0.3V
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully Configurable Dual-Rail Design
      2. 7.3.2 Supports High-Speed Translation
      3. 7.3.3 Partial-Power-Down Mode Operation
      4. 7.3.4 Bus-Hold Circuitry
      5. 7.3.5 VCC Isolation Feature
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGV|24
  • RHL|24
  • PW|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1 Layout Guidelines

For device reliability, TI recommends following the common printed-circuit board layout guidelines.

  • Use bypass capacitors on power supplies.
  • Use short trace lengths to avoid excessive loading.
  • Placing pads on the signal paths for loading capacitors or pullup resistors to help adjust rise and fall times of signals depending on the system requirements.