SCES882E December   2017  – December 2023 SN74AXC1T45

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics: TA = 25°C
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuit and Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 0.65-V to 3.6-V Power-Supply Range
      2. 7.3.2 I/Os with Integrated Static Pull-Down Resistors
      3. 7.3.3 Support High-Speed Translation
      4. 7.3.4 Ioff Supports Partial-Power-Down Mode Operation
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Enable Times
    2. 8.2 Typical Applications
      1. 8.2.1 Unidirectional Logic Level-Shifting Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Bidirectional Logic Level-Shifting Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power-Up Considerations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1) (2) (3)
MINMAXUNIT
VCCASupply voltage A0.653.6V
VCCBSupply voltage B0.653.6V
VIHHigh-level input voltageData InputsVCCI = 0.65 V - 0.75 VVCCI x 0.70V
VCCI = 0.76 V - 1VVCCI x 0.70
VCCI = 1.1V - 1.95 VVCCI x 0.65
VCCI = 2.3V - 2.7V1.6
VCCI = 3V - 3.6V2
Control Input (DIR)
Referenced to VCCA		VCCA = 0.65 V - 0.75 VVCCA x 0.70
VCCA = 0.76 V - 1VVCCA x 0.70
VCCA = 1.1V - 1.95 VVCCA x 0.65
VCCA = 2.3V - 2.7V1.6
VCCA = 3V - 3.6V2
VILLow-level input voltageData InputsVCCI = 0.65 V - 0.75 VVCCI x 0.30V
VCCI = 0.76 V - 1VVCCI x 0.30
VCCI = 1.1V - 1.95 VVCCI x 0.35
VCCI = 2.3V - 2.7V0.7
VCCI = 3V - 3.6V0.8
Control Input (DIR)
Referenced to VCCA		VCCA = 0.65 V - 0.75 VVCCA x 0.30
VCCA = 0.76 V - 1VVCCA x 0.30
VCCA = 1.1V - 1.95 VVCCA x 0.35
VCCA = 2.3V - 2.7V0.7
VCCA = 3V - 3.6V0.8
VIInput voltage (3)03.6V
VOOutput voltageActive State0VCCOV
Tri-State03.6
Δt/ΔvInput transition rate100ns/V
TAOperating free-air temperature–40125°C
(1) VCCI is the VCC associated with the input port.
(2) VCCO is the VCC associated with the output port.
(3) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs.