SCES879A May   2020  – February 2024 SN74AXC2T245

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Thermal Information
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 0.7 ± 0.05V
    7. 5.7  Switching Characteristics, VCCA = 0.8 ± 0.04V
    8. 5.8  Switching Characteristics, VCCA = 0.9 ± 0.045V
    9. 5.9  Switching Characteristics, VCCA = 1.2 ± 0.1V
    10. 5.10 Switching Characteristics, VCCA = 1.5 ± 0.1V
    11. 5.11 Switching Characteristics, VCCA = 1.8 ± 0.15V
    12. 5.12 Switching Characteristics, VCCA = 2.5 ± 0.2V
    13. 5.13 Switching Characteristics, VCCA = 3.3 ± 0.3V
    14. 5.14 Operating Characteristics: TA = 25°C
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuit and Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Standard CMOS Inputs
      2. 7.3.2  Balanced High-Drive CMOS Push-Pull Outputs
      3. 7.3.3  Partial Power Down (Ioff)
      4. 7.3.4  VCC Isolation
      5. 7.3.5  Over-voltage Tolerant Inputs
      6. 7.3.6  Glitch-free Power Supply Sequencing
      7. 7.3.7  Negative Clamping Diodes
      8. 7.3.8  Fully Configurable Dual-Rail Design
      9. 7.3.9  I/Os with Integrated Static Pull-Down Resistors
      10. 7.3.10 Supports High-Speed Translation
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.3 Partial Power Down (Ioff)

The inputs and outputs for this device enter a high-impedance state when the device is powered down, inhibiting current backflow into the device. The maximum leakage into or out of any input or output pin on the device is specified by Ioff in the Section 5.5.