SCES880D August 2019 – January 2024 SN74AXC2T45
PRODUCTION DATA
THERMAL METRIC (1) | SN74AXC2T45 | UNIT | |||
---|---|---|---|---|---|
DCT (SM8) | DCU (VSSOP) | DTM (X2SON) | |||
RθJA | Junction-to-ambient thermal resistance | 223.5 | 242.9 | 225.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 120.7 | 96.2 | 131.6 | °C/W |
RθJB | Junction-to-board thermal resistance | 138.0 | 153.3 | 141.3 | °C/W |
YJT | Junction-to-top characterization parameter | 47.5 | 38.2 | 12.7 | °C/W |
YJB | Junction-to-board characterization parameter | 136.7 | 152.5 | 140.9 | °C/W |