SCES898C July   2019  – May 2022 SN74AXC4T774

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 0.7 ± 0.05 V
    7. 5.7  Switching Characteristics, VCCA = 0.8 ± 0.04 V
    8. 5.8  Switching Characteristics, VCCA = 0.9 ± 0.045 V
    9. 5.9  Switching Characteristics, VCCA = 1.2 ± 0.1 V
    10. 5.10 Switching Characteristics, VCCA = 1.5 ± 0.1 V
    11. 5.11 Switching Characteristics, VCCA = 1.8 ± 0.15 V
    12. 5.12 Switching Characteristics, VCCA = 2.5 ± 0.2 V
    13. 5.13 Switching Characteristics, VCCA = 3.3 ± 0.3 V
    14. 5.14 Operating Characteristics: TA = 25°C
    15. 5.15 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuit and Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Standard CMOS Inputs
      2. 7.3.2  Balanced High-Drive CMOS Push-Pull Outputs
      3. 7.3.3  Partial Power Down (Ioff)
      4. 7.3.4  VCC Isolation
      5. 7.3.5  Over-voltage Tolerant Inputs
      6. 7.3.6  Glitch-Free Power Supply Sequencing
      7. 7.3.7  Negative Clamping Diodes
      8. 7.3.8  Fully Configurable Dual-Rail Design
      9. 7.3.9  I/Os with Integrated Static Pull-Down Resistors
      10. 7.3.10 Supports High-Speed Translation
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision B (May 2021) to Revision C (May 2022)

  • Added the I/Os with Integrated Static Pull-Down Resistors sectionGo

Changes from Revision A (July 2020) to Revision B (May 2021)

  • Updated the Serial Peripheral Interface (SPI) Application figure in the Typical Application sectionGo

Changes from Revision * (July 2019) to Revision A (July 2020)

  • Updated the numbering format for tables, figures and cross-references throughout the documentGo
  • Added BQB (WQFN) package option to Device Information tableGo