SCES898C July   2019  – May 2022 SN74AXC4T774

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 0.7 ± 0.05 V
    7. 5.7  Switching Characteristics, VCCA = 0.8 ± 0.04 V
    8. 5.8  Switching Characteristics, VCCA = 0.9 ± 0.045 V
    9. 5.9  Switching Characteristics, VCCA = 1.2 ± 0.1 V
    10. 5.10 Switching Characteristics, VCCA = 1.5 ± 0.1 V
    11. 5.11 Switching Characteristics, VCCA = 1.8 ± 0.15 V
    12. 5.12 Switching Characteristics, VCCA = 2.5 ± 0.2 V
    13. 5.13 Switching Characteristics, VCCA = 3.3 ± 0.3 V
    14. 5.14 Operating Characteristics: TA = 25°C
    15. 5.15 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuit and Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Standard CMOS Inputs
      2. 7.3.2  Balanced High-Drive CMOS Push-Pull Outputs
      3. 7.3.3  Partial Power Down (Ioff)
      4. 7.3.4  VCC Isolation
      5. 7.3.5  Over-voltage Tolerant Inputs
      6. 7.3.6  Glitch-Free Power Supply Sequencing
      7. 7.3.7  Negative Clamping Diodes
      8. 7.3.8  Fully Configurable Dual-Rail Design
      9. 7.3.9  I/Os with Integrated Static Pull-Down Resistors
      10. 7.3.10 Supports High-Speed Translation
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) SN74AXC4T774 UNIT
PW (TSSOP) RSV (UQFN) BQB (WQFN)
16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 118.2 130.8 73.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 48.6 69.1 70.9 °C/W
RθJB Junction-to-board thermal resistance 64.5 59.9 43.5 °C/W
YJT Junction-to-top characterization parameter 7.3 3.9 4.9 °C/W
YJB Junction-to-board characterization parameter 63.9 58.3 43.5 °C/W
RθJC(bottom) Junction-to-case (bottom) thermal resistance NA NA 21.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.