SCES898C July   2019  – May 2022 SN74AXC4T774

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 0.7 ± 0.05 V
    7. 5.7  Switching Characteristics, VCCA = 0.8 ± 0.04 V
    8. 5.8  Switching Characteristics, VCCA = 0.9 ± 0.045 V
    9. 5.9  Switching Characteristics, VCCA = 1.2 ± 0.1 V
    10. 5.10 Switching Characteristics, VCCA = 1.5 ± 0.1 V
    11. 5.11 Switching Characteristics, VCCA = 1.8 ± 0.15 V
    12. 5.12 Switching Characteristics, VCCA = 2.5 ± 0.2 V
    13. 5.13 Switching Characteristics, VCCA = 3.3 ± 0.3 V
    14. 5.14 Operating Characteristics: TA = 25°C
    15. 5.15 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuit and Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Standard CMOS Inputs
      2. 7.3.2  Balanced High-Drive CMOS Push-Pull Outputs
      3. 7.3.3  Partial Power Down (Ioff)
      4. 7.3.4  VCC Isolation
      5. 7.3.5  Over-voltage Tolerant Inputs
      6. 7.3.6  Glitch-Free Power Supply Sequencing
      7. 7.3.7  Negative Clamping Diodes
      8. 7.3.8  Fully Configurable Dual-Rail Design
      9. 7.3.9  I/Os with Integrated Static Pull-Down Resistors
      10. 7.3.10 Supports High-Speed Translation
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1 Layout Guidelines

For device reliability, following common printed-circuit board layout guidelines are recommended:

  • Use bypass capacitors on the power supply pins and place them as close to the device as possible. A 0.1µF capacitor is recommended, but transient performance can be improved by having both 1µF and 0.1µF capacitors in parallel as bypass capacitors.
  • The high drive capability of this device creates fast edges into light loads so routing and load conditions should be considered to prevent ringing.