SCES892D November   2018  – January 2024 SN74AXC8T245-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 0.7V
    7. 5.7  Switching Characteristics, VCCA = 0.8V
    8. 5.8  Switching Characteristics, VCCA = 0.9V
    9. 5.9  Switching Characteristics, VCCA = 1.2V
    10. 5.10 Switching Characteristics, VCCA = 1.5V
    11. 5.11 Switching Characteristics, VCCA = 1.8V
    12. 5.12 Switching Characteristics, VCCA = 2.5V
    13. 5.13 Switching Characteristics, VCCA = 3.3V
    14. 5.14 Operating Characteristics: TA = 25°C
    15. 5.15 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Up-Translation and Down-Translation From 0.65V to 3.6V
      2. 7.3.2 Multiple Direction Control Pins
      3. 7.3.3 Ioff Supports Partial-Power-Down Mode Operation
      4. 7.3.4 Wettable Flanks
      5. 7.3.5 I/Os with Integrated Static Pull-Down Resistors
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)SN74AXC8T245-Q1-Q1UNIT
PW (TSSOP)RHL (VQFN)WRGY (VQFN)
24 PINS24 PINS24 PINS
RθJAJunction-to-ambient thermal resistance92.035.048.1°C/W
RθJC(top)Junction-to-case (top) thermal resistance29.339.943.2°C/W
RθJBJunction-to-board thermal resistance46.713.826.1°C/W
ψJTJunction-to-top characterization parameter1.50.32.9°C/W
ψJBJunction-to-board characterization parameter46.213.826.0°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/A1.415.8°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.