SCES875C March   2018  – January 2024 SN74AXC8T245

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 0.7V
    7. 5.7  Switching Characteristics, VCCA = 0.8V
    8. 5.8  Switching Characteristics, VCCA = 0.9V
    9. 5.9  Switching Characteristics, VCCA = 1.2V
    10. 5.10 Switching Characteristics, VCCA = 1.5V
    11. 5.11 Switching Characteristics, VCCA = 1.8V
    12. 5.12 Switching Characteristics, VCCA = 2.5V
    13. 5.13 Switching Characteristics, VCCA = 3.3V
    14. 5.14 Operating Characteristics: TA = 25°C
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Up-Translation and Down-Translation From 0.65V to 3.6V
      2. 7.3.2 Multiple Direction Control Pins
      3. 7.3.3 Ioff Supports Partial-Power-Down Mode Operation
      4. 7.3.4 I/Os with Integrated Static Pull-Down Resistors
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3 Power Supply Recommendations

Always apply a ground reference to the GND pins first. There are no additional requirements for power supply sequencing.

This device was designed with various power supply sequencing methods in mind to help prevent unintended triggering of downstream devices. For more information regarding the power up glitch performance of the AXC family of level translators, see the Power Sequencing for AXC Family of Devices application report.