SCES875C March 2018 – January 2024 SN74AXC8T245
PRODUCTION DATA
THERMAL METRIC | SN74AXC8T245 | UNIT | |||
---|---|---|---|---|---|
PW (TSSOP) | RHL (VQFN) | RJW (UQFN) | |||
24 PINS | 24 PINS | 24 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 92.0 | 35.0 | 123.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 29.3 | 39.9 | 65.0 | °C/W |
RθJB | Junction-to-board thermal resistance | 46.7 | 13.8 | 55.3 | °C/W |
ψJT | Junction-to-top characterization parameter | 1.5 | 0.3 | 3.9 | °C/W |
ψJB | Junction-to-board characterization parameter | 46.2 | 13.8 | 54.9 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | 1.4 | N/A | °C/W |