SCES883C December   2018  – September 2020 SN74AXCH1T45

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, VCCA = 0.7 V
    7. 6.7  Switching Characteristics, VCCA = 0.8 V
    8. 6.8  Switching Characteristics, VCCA = 0.9 V
    9. 6.9  Switching Characteristics, VCCA = 1.2 V
    10. 6.10 Switching Characteristics, VCCA = 1.5 V
    11. 6.11 Switching Characteristics, VCCA = 1.8 V
    12. 6.12 Switching Characteristics, VCCA = 2.5 V
    13. 6.13 Switching Characteristics, VCCA = 3.3 V
    14. 6.14 Operating Characteristics: TA = 25°C
    15. 6.15 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Load Circuit and Voltage Waveforms
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Standard CMOS Inputs
      2. 8.3.2 Balanced High-Drive CMOS Push-Pull Outputs
      3. 8.3.3 Partial Power Down (Ioff)
      4. 8.3.4 VCC Isolation
      5. 8.3.5 Over-Voltage Tolerant Inputs
      6. 8.3.6 Negative Clamping Diodes
      7. 8.3.7 Fully Configurable Dual-Rail Design
      8. 8.3.8 Supports High-Speed Translation
      9. 8.3.9 Bus-Hold Data Inputs
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Enable Times
    2. 9.2 Typical Applications
      1. 9.2.1 Interrupt Request Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Universal Asynchronous Receiver-Transmitter (UART) Interface Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision B (June 2020) to Revision C (September 2020)

  • Updated ICCA, ICCB, and ICCA + ICCB to reflect updated performance of device.Go

Changes from Revision A (January 2019) to Revision B (June 2020)

  • Added DRY package option to Device Information tableGo
  • Added pinout drawing for DRY packageGo

Changes from Revision * (December 2018) to Revision A (January 2019)

  • Added DBV and DTQ package options to Device Information table Go
  • Updated Revision History sectionGo
  • Added pinout drawings for DBV and DTQ packages Go
  • Added DRY package to Pin ConfigurationsGo