SCES883C
December 2018 – September 2020
SN74AXCH1T45
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Switching Characteristics, VCCA = 0.7 V
6.7
Switching Characteristics, VCCA = 0.8 V
6.8
Switching Characteristics, VCCA = 0.9 V
6.9
Switching Characteristics, VCCA = 1.2 V
6.10
Switching Characteristics, VCCA = 1.5 V
6.11
Switching Characteristics, VCCA = 1.8 V
6.12
Switching Characteristics, VCCA = 2.5 V
6.13
Switching Characteristics, VCCA = 3.3 V
6.14
Operating Characteristics: TA = 25°C
6.15
Typical Characteristics
7
Parameter Measurement Information
7.1
Load Circuit and Voltage Waveforms
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Standard CMOS Inputs
8.3.2
Balanced High-Drive CMOS Push-Pull Outputs
8.3.3
Partial Power Down (Ioff)
8.3.4
VCC Isolation
8.3.5
Over-Voltage Tolerant Inputs
8.3.6
Negative Clamping Diodes
8.3.7
Fully Configurable Dual-Rail Design
8.3.8
Supports High-Speed Translation
8.3.9
Bus-Hold Data Inputs
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.1.1
Enable Times
9.2
Typical Applications
9.2.1
Interrupt Request Application
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.3
Application Curve
9.2.2
Universal Asynchronous Receiver-Transmitter (UART) Interface Application
9.2.2.1
Design Requirements
9.2.2.2
Detailed Design Procedure
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
Receiving Notification of Documentation Updates
12.3
Support Resources
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DRY|6
MPDS221F
DCK|6
MPDS114E
DTQ|6
MUSS003A
DBV|6
MPDS026Q
Thermal pad, mechanical data (Package|Pins)
DRY|6
QFND138E
Orderable Information
sces883c_oa
sces883c_pm
11.2
Layout Example
Figure 11-1
PCB Layout Example