SCES876A August   2018  – January 2019 SN74AXCH8T245

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Typical Application Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, VCCA = 0.7 V
    7. 6.7  Switching Characteristics, VCCA = 0.8 V
    8. 6.8  Switching Characteristics, VCCA = 0.9 V
    9. 6.9  Switching Characteristics, VCCA = 1.2 V
    10. 6.10 Switching Characteristics, VCCA = 1.5 V
    11. 6.11 Switching Characteristics, VCCA = 1.8 V
    12. 6.12 Switching Characteristics, VCCA = 2.5 V
    13. 6.13 Switching Characteristics, VCCA = 3.3 V
    14. 6.14 Operating Characteristics: TA = 25°C
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Up-Translation and Down-Translation From 0.65 V to 3.6 V
      2. 8.3.2 Multiple Direction Control Pins
      3. 8.3.3 Bus-Hold Circuitry
      4. 8.3.4 Ioff Supports Partial-Power-Down Mode Operation
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Power Supply Recommendations

Always apply a ground reference to the GND pins first. However, there are no additional requirements for power supply sequencing.

This device was designed with various power supply sequencing methods in mind to help prevent unintended triggering of downstream devices. For more information regarding the power up glitch performance of the AXC family of level translators, see the Power Sequencing for AXC Family of Devices application report.