SCDS167A May   2004  – July 2022 SN74CB3Q16211

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Electrical Characteristics
    5. 7.5 Switching Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

GUID-20220713-SS0I-8F85-XL2Q-6K8WV4FDCCXS-low.gif Figure 6-1 DGG, DGV, or DL Package, 56-Pin TSSOP and TVSOP (Top View)
GUID-20220713-SS0I-7XNL-1SZB-VHSJS5HGL9V6-low.gifFigure 6-2 ZQL Package, 56-Pin BGA (Top View)
GUID-20220713-SS0I-TGBH-1M98-5X4PCDCJVSBV-low.gifFigure 6-3 Functions Table