SCDS167A May   2004  – July 2022 SN74CB3Q16211

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Electrical Characteristics
    5. 7.5 Switching Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision * (May 2004) to Revision A (July 2022)

  • Updated document to new TI data sheet format - no specification changes.Go
  • Removed Ordering Information table.Go
  • Added Applications.Go
  • Added Device Information tableGo
  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed the BGA package from: GQL to: ZQL in the Pin Configuration and Functions sectionGo
  • Moved Tstg to Handling Ratings table.Go
  • Added Mechanical, Packaging, and Orderable Information section.Go