SCDS003P November   1992  – December  2015 SN74CBT3383

 

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Data Flow With Near-Zero Propagation Delay
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBQ|24
  • DB|24
  • DW|24
  • PW|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage –0.5 7 V
VI Input voltage(2) –0.5 7 V
IO Continuos channel current 128 mA
IIK Input clamp current (VI/O<0) –50 mA
TJ Junction temperature –65 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±3000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage 4.5 5.5 V
VIH High-level input voltage 2.0 V
VIL Low-level input voltage 0.8 V
TA Operating free-air temperature SN74CBT3383 0 70.0 °C
SN54CBT3383 –55.0 125.0

6.4 Thermal Information

THERMAL METRIC(1) SN74CBT3383 UNIT
DB (SSOP) DBQ (SSOP) DW (SOIC) PW (TSSOP)
24 PINS 24 PINS 24 PINS 24 PINS
RθJA Junction-to-ambient thermal resistance 63.0 61.0 46.0 88.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 33.5 22.1 19.9 26.5 °C/W
RθJB Junction-to-board thermal resistance 32.0 - 19.33 - °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
VIK VCC = 4.5 V, II = –18 mA –1.2 V
II VCC = 5.5 V, VI = 5.5 V or GND SN54CBT3383 ±5 µA
SN74CBT3383 ±1
ICC VCC = 5.5 V, IO = 0, VI = VCC or GND 50 µA
∆ICC(2) Control inputs VCC = 5.5 V,
One input at 3.4 V,
Other inputs at VCC or GND		 2.5 mA
Ci Control inputs VI = 3 V or 0 SN74CBT3383 3 pF
VI = 2.5 V SN54CBT3383 5
Cio(OFF) VO = 3 V or 0, BE = VCC SN74CBT3383 6 pF
VO = 2.5 V, BE = VCC SN54CBT3383 6
ron(3) VCC = 4.5 V VI = 0 II = 64 mA SN54CBT3383 5 9.2 Ω
SN74CBT3383 5 7
II = 30 mA SN74CBT3383 5 7
VI = 2.4 V, II = 15 mA SN54CBT3383 10 17
SN74CBT3383 10 15
(1) Typical values are at VCC = 5 V, TA = 25°C.
(2) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
(3) Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by the lowest voltage of the two (A or B) terminals.

6.6 Switching Characteristics

over recommended ranges of supply voltage and operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 2)
PARAMETER FROM (INPUT) TO (OUTPUT) TEST CONDITIONS MIN MAX UNIT
tpd(1) A or B B or A SN54CBT3383 1.5 ns
SN74CBT3383 0.25
tpd BX A or B SN54CBT3383 1 10.2 ns
SN74CBT3383 1 9.2
ten BE A or B SN54CBT3383 1 10.8 ns
SN74CBT3383 1 8.6
tdis BE A or B SN54CBT3383 1 8.2 ns
SN74CBT3383 1 7.5
(1) The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).

6.7 Typical Characteristics

SN74CBT3383 SN54CBT3383 SCDS003Typ.png Figure 1. ON-Resistance (RON) for II = 64 mA Across VI