SCDS038L December 1997 – August 2022 SN74CBTLV3126
PRODUCTION DATA
| THERMAL METRIC(1) | SN74CBTLV3126 | UNIT | |||||
|---|---|---|---|---|---|---|---|
| D (SOIC) | DGV (TVSOP) | PW (TSSOP) | RGY (VQFN) | DBQ (SSOP) | |||
| 14 PINS | 14 PINS | 14 PINS | 14 PINS | 16 Pins | |||
| RθJA | Junction-to-ambient thermal resistance | 100.6 | 154.8 | 123.3 | 59.6 | 118.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 55.5 | 64.5 | 53.0 | 71.3 | 66.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 56.8 | 88.4 | 66.3 | 35.6 | 62.2 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 17.0 | 11.1 | 9.3 | 4.2 | 20.9 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 56.4 | 87.4 | 65.7 | 35.7 | 61.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | 16.1 | N/A | °C/W |