SCDS271A May   2008  – May 2019 SN74CBTLV3257-EP

 

  1. 1Features
  2. 2Applications
  3. 3Description
    1.     Device Images
  4. 4Revision History
  5. 5Pin Configuration and Functions
    1. 5.1 Function Table
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Electrical Characteristics
    4. 6.4 Switching Characteristics
  7. 7Parameter Measurement Information
  8. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Community Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Controlled baseline
    • One assembly site
    • One test site
    • One fabrication site
  • Extended temperature performance of –55°C to 125°C
  • Enhanced diminishing manufacturing sources (DMS) support
  • Enhanced product-change notification
  • Qualification pedigree (1)
  • 5-Ω switch connection between two ports
  • Rail-to-rail switching on data I/O ports
  • Ioff supports partial-power-down mode operation
  • Latch-up performance exceeds 100 mA per JESD 78, class II
  • ESD protection exceeds JESD 22
    • 2000-V human-body model (A114-A)
    • 200-V machine model (A115-A)
    • 1. Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.