SCDS040M December 1997 – July 2018 SN74CBTLV3257
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | SN74CBTLV3257 | UNIT | |||||
---|---|---|---|---|---|---|---|
D | DBQ | DGV | PW | RGY | |||
16 PINS | 16 PINS | 16 PINS | 16 PINS | 16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 86.7 | 112.4 | 123.1 | 110.9 | 43.8 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 47.8 | 63.6 | 48.7 | 45.8 | 57.2 | °C/W |
RθJB | Junction-to-board thermal resistance | 43.7 | 54.8 | 54.9 | 56.0 | 21.4 | °C/W |
ψJT | Junction-to-top characterization parameter | 12.3 | 17.0 | 5.2 | 5.4 | 1.7 | °C/W |
ψJB | Junction to baord characterization parameter | 43.5 | 54.4 | 54.3 | 55.4 | 21.5 | °C/W |
RθJC(bottom | Junction-to-case (bottom) thermal resistance | - | - | - | - | 9.7 | °C/W |