SCDS047H March   1998  – December 2018 SN74CBTLV3383

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic, Each FET Switch
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGV|24
  • DBQ|24
  • DW|24
  • PW|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) SN74CBTLV3383 UNIT
DBQ
(QSOP)		 DVG
(TVSOP)		 DW
(SPIC)		 PW
(TSSOP)
24 PINS 24 PINS 24 PINS 24 PINS
RθJA Junction-to-ambient thermal resistance 86.6 105.6 66.6 90.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 40.5 36.9 36.7 34.12 °C/W
RθJB Junction-to-board thermal resistance 40.8 51.1 36.6 45.2 °C/W
ψJT Junction-to-top characterization parameter 7.8 2.6 13.1 2.8 °C/W
ψJB Junction-to-board characterization parameter 40.4 50.6 36.4 44.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.