SCDS305D February   2011  – September 2022 SN74GTL2003

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Provides Bidirectional Voltage Translation With No Direction Control Required
      2. 8.3.2 Flow Through Pinout
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Bidirectional Translation
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Sizing Pullup Resistors
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Unidirectional Down Translation
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Sizing Pullup Resistors
      3. 9.2.3 Unidirectional Up Translation
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
          1. 9.2.3.2.1 Sizing Pullup Resistors
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.1 Bidirectional Translation

For the bidirectional clamping configuration (higher voltage to lower voltage or lower voltage to higher voltage), the GREF input must be connected to DREF and both pins pulled to HIGH-side VCC through a pullup resistor (typically 200 kΩ). TI recommends a filter capacitor on DREF. The processor output can be totem pole or open drain (pullup resistors) and the chipset output can be totem pole or open drain (pullup resistors are required to pull the Dn outputs to VCC). However, if either output is totem pole, data must be unidirectional or the outputs must be 3-statable, and the outputs must be controlled by some direction-control mechanism to prevent HIGH-to-LOW contentions in either direction. If both outputs are open drain, no direction control is needed. The opposite side of the reference transistor (SREF) is connected to the processor core power-supply voltage. When DREF is connected through a 200-kΩ resistor to a 3.3-V to 5.5-V VCC supply and SREF is set from 1 V to VCC 1.5 V, the output of each Sn has a maximum output voltage equal to SREF, and the output of each Dn has a maximum output voltage equal to VCC.

GUID-12E76C93-350F-436B-9B58-C6AE9AD7168F-low.gifFigure 9-1 Bidirectional Translation to Multiple Higher Voltage Levels
(Such as an I2C or SMBus Applications)