SCLS470C March   2003  – June 2022 SN54HC109 , SN74HC109

PRODUCTION DATA  

  1. 1 Features
  2. 2 Description
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions (1)
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Timing Requirements
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NS|16
  • N|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage range –0.5 7 V
IIK Input clamp current VI < 0 or VI > VCC ±20 mA
IOK Output clamp current VO < 0 or VO > VCC ±20 mA
IO Continuous output current VO = 0 to VCC ±35 mA
Continuous current through VCC or GND ±70 mA
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds FK package 300 ℃
J package
W package
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds D package 260 ℃
N package
NS package
TJ Junction temperature 150 ℃
Tstg Storage temperature range –65 150 ℃
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.