SCLS136F December   1982  – April 2022 SN54HC273 , SN74HC273

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings – SN74HC273
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Electrical Characteristics – SN54HC273
    7. 6.7  Electrical Characteristics – SN74HC273
    8. 6.8  Timing Requirements
    9. 6.9  Timing Requirements – SN54HC273
    10. 6.10 Timing Requirements – SN74HC273
    11. 6.11 Switching Characteristics
    12. 6.12 Switching Characteristics – SN54HC273
    13. 6.13 Switching Characteristics – SN74HC273
    14. 6.14 Operating Characteristics
    15. 6.15 Typical Characteristics
  7. 7 Parameter Measurement Information
    1.     23
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|20
  • NS|20
  • N|20
  • DW|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision E (August 2003) to Revision F (April 2022)

  • Updated the ESD ratings table to fit modern standardsGo
  • Changed package thermal impedance, RθJA, values from: 90.3 to: 122.7 (DB), from: 77.4 to: 109.1 (DW), from: 45.1 to: 84.6 (N), from: 72.6 to: 113.4 (NS), and from: 98.3 to: 131.8 (PW)Go
  • Updated Power Supply Recommendations and Layout Guidelines sections to include current TI terminologyGo

Changes from Revision D (December 1982) to Revision E (July 2016)

  • Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
  • Removed Ordering Information table, see POA at the end of the data sheetGo
  • Added Military Disclaimer to Features Go