SCLS307D January   1996  – May 2022 SN54HC377 , SN74HC377

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions (1)
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Timing Requirements
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Modes
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NS|20
  • N|20
  • DW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Thermal Information

THERMAL METRIC DW (SOIC) N (PDIP) NS (SO) UNIT
20 PINS 20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance(1) 109.1 84.6 113.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 76 72.5 78.6 °C/W
RθJB Junction-to-board thermal resistance 77.6 65.3 78.4 °C/W
ψJT Junction-to-top characterization parameter 51.5 55.3 47.1 °C/W
ψJB Junction-to-top characterization parameter 77.1 65.2 78.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.