SCLS305E January   1996  – May 2022 SN54HC541 , SN74HC541

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics, TA = 25°C
    6. 6.6  Electrical Characteristics, SN54HC541
    7. 6.7  Electrical Characteristics, SN74HC541
    8. 6.8  Switching Characteristics, CL = 50 pF, TA = 25°C
    9. 6.9  Switching Characteristics, CL = 50 pF, SN54HC541
    10. 6.10 Switching Characteristics, CL = 50 pF, SN74HC541
    11. 6.11 Switching Characteristics, CL = 150 pF, TA = 25°C
    12. 6.12 Switching Characteristics, CL = 150 pF, SN54HC541
    13. 6.13 Switching Characteristics, CL = 150 pF, SN74HC541
    14. 6.14 Operating Characteristics
    15. 6.15 Typical Characteristics
  7. 7 Parameter Measurement Information
    1.     24
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|20
  • NS|20
  • N|20
  • DW|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC SN74HC541 UNIT
DB (SSOP) DW (SOIC) N (PDIP) NS (SO) PW (TSSOP)
20 PINS 20 PINS 20 PINS 20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance(1) 122.7 109.1 84.6 113.4 131.8 °C/W
RθJC (top) Junction-to-case (top) thermal resistance 81.6 76 72.5 78.6 72.2 °C/W
RθJB Junction-to-board thermal resistance 77.5 77.6 65.3 78.4 82.8 °C/W
ΨJT Junction-to-top characterization parameter 46.1 51.5 55.3 47.1 21.5 °C/W
ΨJB Junction-to-board characterization parameter 77.1 77.1 65.2 78.1 82.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.