SCLS756E May   2019  – December 2021 SN74HCS08-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 CMOS Schmitt-Trigger Inputs
      3. 8.3.3 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision D (March 2021) to Revision E (December 2021)

  • Added DYY package information to Device Information Table Go
  • Added DYY package information to Pin Configuration and Functions Go
  • Added DYY package to Thermal Information tableGo

Changes from Revision C (September 2019) to Revision D (March 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added BQA package information to Device Information Go
  • Added BQA package information to Pin Configuration and Functions Go
  • Added BQA package to Thermal Information tableGo

Changes from Revision B (August 2019) to Revision C (September 2019)

  • Added D package to Device Information tableGo
  • Added D package column to Thermal Information tableGo

Changes from Revision A (July 2019) to Revision B (August 2019)

  • Deleted "ICC" and "output" from "Continuous current through VCC or GND" row for clarityGo

Changes from Revision * (May 2019) to Revision A (July 2019)

  • Changed from Advanced Information to Production DataGo