SCLS811D September   2020  – December 2021 SN74HCS138-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     4
    2.     5
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 CMOS Schmitt-Trigger Inputs
      3. 8.3.3 Clamp Diode Structure
      4. 8.3.4 Wettable Flanks
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-20200706-SS0I-KVRZ-G4DJ-NPRZDXGDM8RJ-low.gifD, PW, or DYY Package
16-Pin SOIC, TSSOP, or SOT
Top View
GUID-20201002-CA0I-TDZV-FCM4-Z78JR4PQZQN0-low.gifBQB or WBQB Package
16-Pin WQFN
Top View
Table 5-1 Pin Functions
PIN I/O(1) DESCRIPTION
SOIC, TSSOP, or SOT NO. NAME
1 A0 I Address select 0
2 A1 I Address select 1
3 A2 I Address select 2
4 G0 I Strobe input, active low
5 G1 I Strobe input, active low
6 G2 I Strobe input
7 Y7 O Output 7
8 GND — Ground
9 Y6 O Output 6
10 Y5 O Output 5
11 Y4 O Output 4
12 Y3 O Output 3
13 Y2 O Output 2
14 Y1 O Output 1
15 Y0 O Output 0
16 VCC — Positive supply
Thermal Pad(2) — The thermal pad can be connect to GND or left floating. Do not connect to any other signal or supply.
(1) Signal Types: I = Input, O = Output, I/O = Input or Output.
(2) BQB and WBQB package only.