SCLS827B August   2020  – December 2021 SN74HCS164

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     4
      1.      5
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 CMOS Schmitt-Trigger Inputs
      3. 8.3.3 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-DED66B87-B175-4643-96BA-301B9E2E71AB-low.gifD, PW or DYY Package
16-Pin SOIC, TSSOP or SOT-23-THIN
Top View
GUID-20201111-CA0I-ZGTX-DLMP-CGLC7R64RFDH-low.gifBQA Package
16-Pin WQFN
Top View
PIN I/O DESCRIPTION
SOIC, TSSOP or SOT-23-THIN NO. NAME
1 A I Serial input A
2 B I Serial input B
3 QA O Parallel output A
4 QB O Parallel output B
5 QC O Parallel output C
6 QD O Parallel output D
7 GND — Ground
8 CLK I Clock, rising edge triggered
9 CLR I Clear 1 Active-Low
10 QE O Parallel output E
11 QF O Parallel output F
12 QG O Parallel output G
13 QH O Parallel output H
14 VCC — Positive supply
Thermal Pad(1) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply
(1) BQA Package only.