SCLS871B
July 2021 – August 2024
SN74HCS240
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
5
6
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Switching Characteristics
5.7
Operating Characteristics
5.8
Typical Characteristics
6
Parameter Measurement Information
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Feature Description
7.3.1.1
Balanced CMOS 3-State Outputs
7.3.1.2
Balanced CMOS Push-Pull Outputs
7.3.1.3
Open-Drain CMOS Outputs
7.3.1.4
CMOS Schmitt-Trigger Inputs
7.3.1.5
TTL-Compatible CMOS Inputs
7.3.1.6
Standard CMOS Inputs
7.3.1.7
Clamp Diode Structure
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.1.1
Power Considerations
8.2.1.2
Input Considerations
8.2.1.3
Output Considerations
8.2.2
Detailed Design Procedure
8.2.3
Application Curve
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
Receiving Notification of Documentation Updates
9.3
Support Resources
9.4
Trademarks
9.5
Electrostatic Discharge Caution
9.6
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RKS|20
MPQF266C
Thermal pad, mechanical data (Package|Pins)
RKS|20
QFND312B
Orderable Information
scls871b_oa
scls871b_pm
8.2.1
Design Requirements