SCLS871B July   2021  – August 2024 SN74HCS240

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5.   5
  6.   6
  7. Pin Configuration and Functions
  8. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
    8. 5.8 Typical Characteristics
  9. Parameter Measurement Information
  10. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Feature Description
        1. 7.3.1.1 Balanced CMOS 3-State Outputs
        2. 7.3.1.2 Balanced CMOS Push-Pull Outputs
        3. 7.3.1.3 Open-Drain CMOS Outputs
        4. 7.3.1.4 CMOS Schmitt-Trigger Inputs
        5. 7.3.1.5 TTL-Compatible CMOS Inputs
        6. 7.3.1.6 Standard CMOS Inputs
        7. 7.3.1.7 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  11. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  12. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  13. 10Revision History
  14. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Example

SN74HCS240 Example trace corners for improved signal integrityFigure 8-3 Example trace corners for improved signal integrity
SN74HCS240 Example bypass capacitor placement for TSSOP and similar packagesFigure 8-4 Example bypass capacitor placement for TSSOP and similar packages
SN74HCS240 Example bypass capacitor placement for SOT, SC70 and similar packagesFigure 8-6 Example bypass capacitor placement for SOT, SC70 and similar packages
SN74HCS240 Example bypass capacitor placement for WQFN and similar packagesFigure 8-5 Example bypass capacitor placement for WQFN and similar packages
SN74HCS240 Example damping resistor placement for improved signal integrityFigure 8-7 Example damping resistor placement for improved signal integrity