SCLS871B July   2021  – August 2024 SN74HCS240

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5.   5
  6.   6
  7. 4 Pin Configuration and Functions
  8. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
    8. 5.8 Typical Characteristics
  9. 6 Parameter Measurement Information
  10. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Feature Description
        1. 7.3.1.1 Balanced CMOS 3-State Outputs
        2. 7.3.1.2 Balanced CMOS Push-Pull Outputs
        3. 7.3.1.3 Open-Drain CMOS Outputs
        4. 7.3.1.4 CMOS Schmitt-Trigger Inputs
        5. 7.3.1.5 TTL-Compatible CMOS Inputs
        6. 7.3.1.6 Standard CMOS Inputs
        7. 7.3.1.7 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  11. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  12. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  13. 10Revision History
  14. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision A (October 2021) to Revision B (August 2024)

  • Added DGS package to Device Information table, Pin Configuration and Functions section, and Thermal Information tableGo

Changes from Revision * (July 2021) to Revision A (October 2021)

  • Changed data sheet from advance information to production dataGo