SCLS800A March 2020 – June 2020 SN74HCS30
PRODUCTION DATA.
THERMAL METRIC(1) | SN74HCS30 | UNIT | ||
---|---|---|---|---|
PW (TSSOP) | D (SOIC) | |||
14 PINS | 14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 151.7 | 133.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 79.4 | 89.0 | °C/W |
RθJB | Junction-to-board thermal resistance | 94.7 | 89.5 | °C/W |
ΨJT | Junction-to-top characterization parameter | 25.2 | 45.5 | °C/W |
ΨJB | Junction-to-board characterization parameter | 94.1 | 89.1 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |