SCLS876A October   2021  – December 2022 SN74HCS573

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     4
    2.     5
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     8
    2.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics
    7.     17
    8. 6.7 Switching Characteristics
    9. 6.8 Operating Characteristics
    10. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS 3-State Outputs
      2. 8.3.2 CMOS Schmitt-Trigger Inputs
      3. 8.3.3 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) SN74HCS573 UNIT
RKS (VQFN) DGS (VSSOP)
20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 83.2 130.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 82.6 68.7 °C/W
RθJB Junction-to-board thermal resistance 57.4 85.4 °C/W
ΨJT Junction-to-top characterization parameter 14.5 10.5 °C/W
ΨJB Junction-to-board characterization parameter 56.4 85.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 40.0 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.