SCLS807E june   2020  – july 2023 SN74HCS594-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 CMOS Schmitt-Trigger Inputs
      3. 8.3.3 Clamp Diode Structure
      4. 8.3.4 Wettable Flanks
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision D (December 2021) to Revision E (July 2023)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated Package Information table to include package leadsGo
  • Updated the Function Table Go

Changes from Revision C (June 2021) to Revision D (December 2021)

  • Added WBQB package information to Device Information tableGo
  • Added WBQB Package, pinout diagram and information to Pin Configuration and Functions.Go
  • Added WBQB package to Thermal Information tableGo
  • Added Wettable Flanks section to Feature Description Go

Changes from Revision B (March 2021) to Revision C (June 2021)

  • Changed DYY package from product preview to productionGo

Changes from Revision A (February 2021) to Revision B (March 2021)

  • Added DYY package information to Device Information tableGo
  • Added DYY Package, pinout diagram and information to Pin Configuration and Functions.Go
  • Added DYY Package to Thermal Information tableGo

Changes from Revision * (June 2020) to Revision A (February 2021)

  • Added BQB package information to Device Information Go
  • Added BQB Package, information to Pin Configuration and Functions Go
  • Added BQB Package to Thermal Information tableGo