SCLS066E March   1982  – August 2022 SN74HCT139

PRODUCTION DATA  

  1. 1 Features
  2. 2 Description
  3. 3 Revision History
  4. 4 Description (continued)
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Rating
    2. 6.2 Recommended Operating Conditions (1)
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Switching Characteristics
    6. 6.6 Operating Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Modes
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|16
  • PW|16
  • N|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Thermal Information

THERMAL METRIC(1) D (SOIC) DB (SSOP) N (PDIP) PW (TSSOP) UNIT
16 PINS 16 PINS 16 PINS 16 PINS
RθJA Package thermal impedance 73 82 67 108 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.