SCLS177H March   1984  – August 2024 SN74HCT574

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommended Operating Conditions
    3. 4.3 Thermal Information
    4. 4.4 Electrical Characteristics
    5. 4.5 Timing Requirements
    6. 4.6 Switching Characteristics, CL = 50 pF
    7. 4.7 Switching Characteristics, CL = 150 pF
    8. 4.8 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|20
  • NS|20
  • N|20
  • DGS|20
  • DW|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.3 Thermal Information

THERMAL METRIC DGS (VSSOP) DW (SOIC) DB (SSOP) N (PDIP) NS (SO) PW (TSSOP) UNIT
20 PINS 20 PINS 20 PINS 20 PINS 20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance(1) 130.6 109.1 122.7 84.6 113.4 131.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 68.7 76 81.6 72.5 78.6 72.2 °C/W
RθJB Junction-to-board thermal resistance 85.4 77.6 77.5 65.3 78.4 82.8 °C/W
ψJT Junction-to-top characterization parameter 10.5 51.5 46.1 55.3 47.1 21.5 °C/W
ψJB Junction-to-board characterization parameter 85.0 77.1 77.1 65.2 78.1 82.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.