SCLS177H March   1984  – August 2024 SN74HCT574

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommended Operating Conditions
    3. 4.3 Thermal Information
    4. 4.4 Electrical Characteristics
    5. 4.5 Timing Requirements
    6. 4.6 Switching Characteristics
    7. 4.7 Switching Characteristics
    8. 4.8 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|20
  • NS|20
  • N|20
  • DGS|20
  • DW|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)

4.3 Thermal Information

THERMAL METRIC DGS (VSSOP) DW (SOIC) DB (SSOP) N (PDIP) NS (SO) PW (TSSOP) UNIT
20 PINS 20 PINS 20 PINS 20 PINS 20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance(1) 130.6 109.1 122.7 84.6 113.4 131.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 68.7 76 81.6 72.5 78.6 72.2 °C/W
RθJB Junction-to-board thermal resistance 85.4 77.6 77.5 65.3 78.4 82.8 °C/W
ψJT Junction-to-top characterization parameter 10.5 51.5 46.1 55.3 47.1 21.5 °C/W
ψJB Junction-to-board characterization parameter 85.0 77.1 77.1 65.2 78.1 82.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.