Refer to the PDF data sheet for device specific package drawings
These hex buffers and drivers feature high-voltage open-collector outputs to interface with high-level circuits or for driving high-current loads. They are also characterized for use as buffers for driving TTL inputs. The SN74LS07 devices have a rated output voltage of 30 V. The maximum sink current is 40 mA.
These circuits are compatible with most TTL families. Inputs are diode-clamped to minimize transmission-line effects, which simplifies design. Typical power dissipation is 140 mW, and average propagation delay time is 12 ns.
PART NUMBER | PACKAGE (PINS) | BODY SIZE (NOM) |
---|---|---|
SN74LS07D | SOIC (14) | 8.65 mm × 3.90 mm |
SN74LS07DB | SSOP (14) | 6.20 mm × 5.30 mm |
SN74LS07N | PDIP (14) | 19.30 mm × 6.35 mm |
SN74LS07NS | SO (14) | 10.30 mm × 5.30 mm |
Changes from C Revision (February 2004) to D Revision
PIN | I/O | DESCRIPTION | |
---|---|---|---|
NO. | NAME | ||
1 | 1A | I | Input 1 |
2 | 1Y | O | Output 1 |
3 | 2A | I | Input 2 |
4 | 2Y | O | Output 2 |
5 | 3A | I | Input 3 |
6 | 3Y | O | Output 3 |
7 | GND | — | Ground pin |
8 | 4Y | O | Output 4 |
9 | 4A | I | Input 4 |
10 | 5Y | O | Output 5 |
11 | 5A | I | Input 5 |
12 | 6Y | O | Output 6 |
13 | 6A | I | Input 6 |
14 | VCC | — | Power pin |
MIN | MAX | UNIT | |||
---|---|---|---|---|---|
VCC | Supply voltage | 7 | V | ||
VI | Input voltage(2) | 7 | V | ||
VO | Output voltage(2)(3) | 30 | V | ||
TJ | Operating virtual junction temperature | 150 | °C | ||
Tstg | Storage temperature | –65 | 150 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±1000 |
MIN | NOM | MAX | UNIT | |||
---|---|---|---|---|---|---|
VCC | Supply voltage | 4.75 | 5 | 5.25 | V | |
VIH | High-level input voltage | 2 | V | |||
VIL | Low-level input voltage | 0.8 | V | |||
VOH | High-level output voltage | 30 | V | |||
IOL | Low-level output current | 40 | mA | |||
TA | Operating free-air temperature | 0 | 70 | °C |
THERMAL METRIC(1) | SN74LS07 | UNIT | ||||
---|---|---|---|---|---|---|
D (SOIC) |
DB (SSOP) |
N (PDIP) |
NS (SO) |
|||
14 PINS | 14 PINS | 14 PINS | 14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 85.2 | 97.4 | 50.2 | 82.8 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 43.5 | 49.8 | 37.5 | 40.9 | °C/W |
RθJB | Junction-to-board thermal resistance | 39.7 | 44.5 | 30 | 41.4 | °C/W |
ψJT | Junction-to-top characterization parameter | 10.9 | 16.5 | 22.3 | 12.4 | °C/W |
ψJB | Junction-to-board characterization parameter | 39.4 | 44 | 29.9 | 41.1 | °C/W |
PARAMETER | TEST CONDITIONS(1) | MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|---|---|
VIK | VCC = MIN, II = –12 mA | –1.5 | V | ||||
IOH | VCC = MIN, VIH = 2 V | VOH = 30 V | 0.25 | mA | |||
VOL | VCC = MIN, VIL = 0.8 V | IOL = 16 mA | 0.4 | V | |||
IOL = MAX(2) | 0.7 | ||||||
II | VCC = MAX, VI = 7 V | 1 | mA | ||||
IIH | VCC = MAX, VI = 2.4 V | 20 | µA | ||||
IIL | VCC = MAX, VI = 0.4 V | –0.2 | mA | ||||
ICCH | VCC = MAX | 14 | mA | ||||
ICCL | VCC = MAX | 45 | mA |
PARAMETER | FROM (INPUT) |
TO (OUTPUT) |
TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|---|---|
tPLH | A | Y | RL = 110 Ω, CL = 15 pF | 6 | 10 | ns | ||
tPHL | 19 | 30 |