SDLS021D May   1990  – April 2016 SN74LS07

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resource
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • DB|14
  • N|14
  • NS|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

D, DB, N, or NS Packages
14-Pin SOIC, SSOP, PDIP, SO
Top View

Pin Functions

PIN I/O DESCRIPTION
NO. NAME
1 1A I Input 1
2 1Y O Output 1
3 2A I Input 2
4 2Y O Output 2
5 3A I Input 3
6 3Y O Output 3
7 GND — Ground pin
8 4Y O Output 4
9 4A I Input 4
10 5Y O Output 5
11 5A I Input 5
12 6Y O Output 6
13 6A I Input 6
14 VCC — Power pin