SCLS403K April   1998  – March 2023 SN74LV164A

PRODMIX  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: VCC = 2.5 V ± 0.2 V
    7. 6.7  Timing Requirements: VCC = 3.3 V ± 0.3 V
    8. 6.8  Timing Requirements: VCC = 5 V ± 0.5 V
    9. 6.9  Switching Characteristics: VCC = 2.5 V ± 0.2 V
    10. 6.10 Switching Characteristics: VCC = 3.3 V ± 0.3 V
    11. 6.11 Switching Characteristics: VCC = 5 V ± 0.5 V
    12. 6.12 Noise Characteristics
    13. 6.13 Operating Characteristics
    14. 6.14 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • RGY|14
  • DB|14
  • DGV|14
  • PW|14
  • BQA|14
  • NS|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision J (December 2022) to Revision K (March 2023)

  • Updated the structural layout of documentGo
  • Updated thermal values for D package from RθJA = 92.6 to 112.9, RθJC(top) = 53.9 to 68.7, RθJB = 46.8 to 69.4, ΨJT = 18.9 to 30, ΨJB = 46.6 to 69, all values in °C/W Go

Changes from Revision I (February 2015) to Revision J (December 2022)

  • Updated the format of tables, figures, and cross-references throughout the documentGo

Changes from Revision H (April 2005) to Revision I (February 2015)

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go