SCLS738E September   2013  – May 2024 SN74LV1T04

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Related Products
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Clamp Diode Structure
      2. 8.3.2 Balanced CMOS Push-Pull Outputs
    4. 8.4 LVxT Enhanced Input Voltage
      1. 8.4.1 Down Translation
      2. 8.4.2 Up Translation
    5. 8.5 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Power Supply Recommendations
    2. 9.2 Layout
      1. 9.2.1 Layout Guidelines
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Revision History

Changes from Revision D (October 2023) to Revision E (May 2024)

  • Updated RθJA values: DBV = 206 to 278, all values in °C/W Go

Changes from Revision C (June 2022) to Revision D (October 2023)

  • Added package size to Package Information tableGo
  • Updated thermal values for DCK package from RθJA = 293.4 to 289.2, all values in °C/W Go