SCLS739E September   2013  – March 2024 SN74LV1T08

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Related Products
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 LVxT Enhanced Input Voltage
        1. 8.3.2.1 Up Translation
        2. 8.3.2.2 Down Translation
      3. 8.3.3 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Power Supply Recommendations
    2. 9.2 Layout
      1. 9.2.1 Layout Guidelines
      2. 9.2.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support (Analog)
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.8 Typical Characteristics

SN74LV1T08 Excellent Signal Integrity (1.8 V to 3.3 V at 3.3-V VCC)
Figure 6-1 Excellent Signal Integrity
(1.8 V to 3.3 V at 3.3-V VCC)
SN74LV1T08 Excellent Signal Integrity (3.3 V to 1.8 V at 1.8-V VCC)
Figure 6-3 Excellent Signal Integrity
(3.3 V to 1.8 V at 1.8-V VCC)
SN74LV1T08 Excellent Signal Integrity (3.3 V to 3.3 V at 3.3-V VCC)
Figure 6-2 Excellent Signal Integrity
(3.3 V to 3.3 V at 3.3-V VCC)