SCLS945A July   2023  – January 2024 SN74LV1T32-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics: 1.8-V VCC
    7. 5.7  Switching Characteristics: 2.5-V VCC
    8. 5.8  Switching Characteristics: 3.3-V VCC
    9. 5.9  Switching Characteristics: 5.0-V VCC
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 LVxT Enhanced Input Voltage
        1. 7.3.2.1 Down Translation
        2. 7.3.2.2 Up Translation
      3. 7.3.3 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 Application Curves
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision * (July 2023) to Revision A (January 2024)

  • Added DBV package to Package Information tableGo
  • Added DBV package to Pin Configuration and Functions sectionGo
  • Added thermal values for DBV package: RθJA = 278.0, RθJC(top) = 180.5, RθJB = 184.4, ΨJT = 115.4, ΨJB = 183.4, RθJC(bot) = N/A, all values in °C/WGo
  • Changed below the specified VIL(MAX) to above the specified VIL(MAX) in the LVxT Enhanced Input Voltage sectionGo