SCLS903B May   2022  – November 2023 SN74LV1T34-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics - 1.8-V VCC
    7. 5.7  Switching Characteristics - 2.5-V VCC
    8. 5.8  Switching Characteristics - 3.3-V VCC
    9. 5.9  Switching Characteristics - 5.0-V VCC
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 Clamp Diode Structure
      3. 7.3.3 LVxT Enhanced Input Voltage
        1. 7.3.3.1 Down Translation
        2. 7.3.3.2 Up Translation
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
  • DCK|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • AEC-Q100 qualified for automotive applications:

    • Device temperature grade 1: -40°C to +125°C

    • Device HBM ESD classification level 2

    • Device CDM ESD classification level C4B

  • Wide operating range of 1.8 V to 5.5 V

  • Single-supply voltage translator (refer to LVxT Enhanced Input Voltage):

    • Up translation:

      • 1.2 V to 1.8 V

      • 1.5 V to 2.5 V

      • 1.8 V to 3.3 V

      • 3.3 V to 5.0 V

    • Down translation:

      • 5.0 V, 3.3 V, 2.5 V to 1.8 V
      • 5.0 V, 3.3 V to 2.5 V
      • 5.0 V to 3.3 V
  • 5.5 V tolerant input pins
  • Supports standard pinouts
  • Up to 150 Mbps with 5 V or 3.3 V VCC
  • Latch-up performance exceeds 250 mA per
    JESD 17