SCES339F September   2000  – May 2024 SN74LV20A

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Information
    5. 4.5  Electrical Characteristics
    6. 4.6  Switching Characteristics, VCC = 2.5 V ± 0.2 V
    7. 4.7  Switching Characteristics, VCC = 3.3 V ± 0.3 V
    8. 4.8  Switching Characteristics, VCC = 5 V ± 0.5 V
    9. 4.9  Noise Characteristics
    10. 4.10 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • DB|14
  • DGV|14
  • PW|14
  • NS|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.4 Thermal Information

THERMAL METRIC(1) SN74LV20A UNIT
D DB DGV NS PW
14 PINS 14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 86 96 127 76 113 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).