SCLS383R september   1997  – august 2023 SN74LV244A

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Noise Characteristics
    7. 6.7  Operating Characteristics
    8. 6.8  Switching Characteristics: VCC = 2.5 V ± 0.2 V
    9. 6.9  Switching Characteristics: VCC = 3.3 V ± 0.3 V
    10. 6.10 Switching Characteristics: VCC = 5 V ± 0.5 V
    11. 6.11 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS 3-State Outputs
      2. 8.3.2 Standard CMOS Inputs
      3. 8.3.3 Partial Power Down (Ioff)
      4. 8.3.4 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Power Considerations
      2. 9.2.2 Input Considerations
      3. 9.2.3 Output Considerations
      4. 9.2.4 Detailed Design Procedure
      5. 9.2.5 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)SN74LV244AUNIT
DB
(SSOP)		DGV
(TVSOP)		DW
(SOIC)		NS
(SO)		PW
(TSSOP)		RGY
(VQFN)

RKS
(VQFN)

DGS
(VSSOP)

20 PINS20 PINS20 PINS20 PINS20 PINS20 PINS

20 PINS

20 PINS
RθJAJunction-to-ambient thermal resistance118.2115.9102.3108.1128.234.9

75.2

125.5°C/W
RθJC(top)Junction-to-case (top) thermal resistance77.231.169.973.970.543.1

79.4

80.0°C/W
RθJBJunction-to-board thermal resistance7357.470.873.179.312.7

47.8

63.8°C/W
ψJTJunction-to-top characterization parameter42.21.046.444.123.40.9

14.6

8.4°C/W
ψJBJunction-to-board characterization parameter72.656.770.472.878.912.8

47.8

79.9°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/AN/AN/A7.831.5N/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.