4 Revision History
Changes from Revision C (October 2007) to Revision D (March 2023)
- Added Applications, Package Information table, Pin
Functions table, ESD Ratings table, Thermal Information
table, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section,
Device and Documentation Support section, and Mechanical,
Packaging, and Orderable Information sectionGo
- Updated thermal values for PW package from RθJA = 83 to 128.2, all
values in °C/W Go